ODYSSEV partners participated in the International Power Electronics Conference (IPEC 2026 – ECCE Asia), held from 31 May to 4 June 2026 in Nagasaki, Japan. The conference brought together researchers, industry representatives, and experts from across the world to discuss recent developments in power electronics and related technologies.
Representatives from Mitsubishi Electric Europe (MEU), University of Applied Sciences and Arts Dortmund (FHDO), and University of Applied Sciences Northwestern Switzerland (FHNW) took part in the event through technical discussions and conference sessions. MEU contributed to the conference programme by chairing a session on power semiconductors, which featured presentations on recent advances in semiconductor technologies, including device development, applications, and reliability aspects. Researchers from FHDO and FHNW also attended the conference, engaging with the latest research developments and discussions in the field of power electronics.
During the power semiconductor session chaired by MEU, Markus Thoben (FHDO) delivered a presentation titled ‘Testing Automotive Power Modules According to AQG 324’. The scope and results of the ECPE working group were presented, bringing together experts from approximately 40 industrial companies across the automotive value chain in Europe, Asia, and the US, who are developing and refining qualification routines for AQG 324 — the ‘Automotive Qualification Guideline for Power Modules’ — in support of the transition toward electric mobility.
Participation in IPEC 2026 provided an opportunity for ODYSSEV partners to engage with the international power electronics community, exchange knowledge with researchers and industry experts, and stay informed about current trends and developments in the field.
Stay connected with ODYSSEV on LinkedIn, Facebook and X for the latest project news.
