We are pleased to announce a new synergy with FLAGCHIP, a Horizon Europe project working on advanced wide bandgap (WBG) and ultra-wide bandgap (UWBG) semiconductor technologies and their integration into compact and cost-effective power modules.
FLAGCHIP aims to advance power electronics through innovations at the device, package and integrated-module levels, while strengthening the Condition and Health Monitoring (C&HM) of power electronic components. Among its activities, the project is developing new SiC MOSFET chip technologies with increased blocking-voltage capability, innovative packaging structures with integrated sensors and thermal management solutions, as well as new approaches for monitoring the temperature, degradation and health status of power modules.
The project will validate these developments through AC/DC and DC/DC applications, including an MVDC converter pilot in France and an offshore wind turbine and substation converter architecture in Norway. FLAGCHIP also addresses the cost efficiency of power electronics solutions, including techno-economic aspects related to condition and health monitoring and maintenance.
These activities create interesting points of connection with ODYSSEV. In particular, both projects address challenges related to advanced power semiconductor technologies, power modules, thermal management, reliability and efficient high-voltage power conversion. While FLAGCHIP focuses on the development and integration of advanced semiconductors and power-module technologies for energy applications, ODYSSEV explores their role within next-generation electric vehicle powertrains.
The synergy between the two projects will provide opportunities for knowledge exchange, joint dissemination and communication activities, and cross-project visibility. ODYSSEV and FLAGCHIP partners will also have joint presence in conferences, boosting their collaboration! By sharing experiences from different application domains, FLAGCHIP and ODYSSEV can contribute to a broader understanding of the opportunities and challenges associated with the development of efficient, reliable and cost-effective high-voltage power electronics.
We look forward to strengthening this collaboration with the FLAGCHIP consortium and to exchanging knowledge and experiences throughout the projects, enabling more efficient, reliable and sustainable electrified systems through advanced power electronics technologies.
